Description: 1.High precision with a small laser spot size of only 0.06 mm. 2.Cutting depth in one pass - up to 12 mm. 3.Large working area - 400 × 415 mm. 4.Fast focusing. 5.Built-in level. 6.Convenient modular design. 7.High safety characteristics according to FDA standards.
Specification:
1.Machine Type: Semiconductor Laser Machine.
2.Engraving Area (mm): 400 × 415.
3.Laser Type: Semiconductor Laser.
4.Laser Output Power (W): 10.
5.Laser Wavelength (nm): 455 ± 5.
6.Laser Spot Size (mm): 0.06.
7.Engraving Depth (mm): 0 – 10.
8.Cutting Thickness (mm): 0 – 18.
9.Engraving Accuracy (dpi): 254.
10.Engraving Speed (mm/min): max. 10 000.
11.Safety Class: FDA Class I.
12.Air Filter: Yes.
13.Supported File Types: JPEG, JPG, PNG, BMP, SVG, DXF, GCODE.
14.Operating System: Windows / MacOS.
15.Supported Materials: Cardboard, wood, bamboo, clappers, rubber, leather, fabric, acrylic, plastic, metal.
16.Software: Laser GRBL, Light Burn.
17.Connectivity: TF Card, Type-C.
18.Power Requirements: Input: 100~220V 50~60Hz, Output: DC 24V 3A.
19.Certifications: IEC60825, FDA, CE, ROHS, FCC, UKCA, PSE.
20.Weight Netto (kg): 3.2.
21.Dimensions Netto (mm): 568 × 632 × 198.
22.Operating Temperature Range (°C): 0 – 35.
23.Operating Humidity Range (%): 20 – 90.
